Qualcomm launched the Snapdragon 888 chipset in December, and now a popular tipster suggests the San Diego company is already well underway with testing its next-gen most premium platform. It has model number SM8450 and a code name Waipio, after the Waipi’o Valley in Hawaii. According to WinFuture, the new chip could bring some camera innovations, since a new imaging module called Leica1 is part of the SoC. According to the leakster, this platform will be manufactured by Samsung. What is more interesting is the partnership with Leica - the company has so far partnered with Huawei...
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