We already know the Poco F4 is coming soon and it will be powered by the Snapdragon 870 chipset. Now Poco is sharing more info on the cooling setup of the device which is dubbed Liquidcool 2.0. According to Poco, this is a seven-layer 3,112mm2 vapor chamber with graphite sheets. With Liquidcool 2.0, we are further upping the game when it comes to thermal management. During strenuous tasks, as the chipset gets hotter, the vapour chamber absorbs the heat generated and turns the liquid inside into vapour, which then condenses & brings down the ambient [5/6] pic.twitter.com/ch85IKLUvp— POCO...
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